Wafer bonding techniques for hybrid silicon photonic devices based on surface modifications

Keyphrases

• Surface Modification 100%
• Bonding Process 100%
• Wafer Bonding 100%
• Silicon Photonic Device 100%
• Hybrid Silicon Photonics 100%
• Device-independent 100%
• Low Temperature 33%
• Functional Groups 33%
• Light Source 33%
• Organic Molecules 33%
• Lithium Niobate 33%
• Optical Coupling 33%
• Silicon Material 33%
• Chemical Functionalization 33%
• Hybrid Silicon 33%
• Low-temperature Bonding 33%
• Bonding Interface 33%
• Active Photonic Devices 33%
• Microroughness 33%
• Indium Phosphide 33%
• Outgassing 33%
• Molecular Bonding 33%
• Materials Platforms 33%
• Light Modulator 33%
• Specific Substrate 33%

Material Science

• Monolayers 100%
• Silicon 100%
• Silicon-Based Photonic Device 100%
• Surface Treatment 100%
• Lithium Niobate 33%
• Indium 33%
• Silicon Material 33%
• Optical Device 33%
• Molecular Bonding 33%