Abstract
Miniaturized, integrated thermal sensors are utilized to measure hot and cold spots in CPU's in multiple locations and are critical for the power/performance of the chip. In this paper we report an ultra-miniature, 0.003 mm2, PNP thermal sensor in TSMC 65nm. The sensor utilizes a novel switched-capacitor bandgap reference and a single bit sigma-delta modulator to achieve a maximum error of ±1.35°C and a resolution of 130mK for a 12 bit, 4ms conversion. The sensor is the smallest reported BJT bandgap-based sensor, especially when considering the process node, and one of the smallest in all mechanisms. It has a competitive accuracy and resolution compared to compact bandgap-based sensors which can meet the CPU area specifications (< 0.02 mm2).
Original language | English |
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Title of host publication | ESSCIRC 2018 - IEEE 44th European Solid State Circuits Conference |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 110-113 |
Number of pages | 4 |
ISBN (Electronic) | 9781538654040 |
DOIs | |
State | Published - 16 Oct 2018 |
Event | 44th IEEE European Solid State Circuits Conference, ESSCIRC 2018 - Dresden, Germany Duration: 3 Sep 2018 → 6 Sep 2018 |
Publication series
Name | ESSCIRC 2018 - IEEE 44th European Solid State Circuits Conference |
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Conference
Conference | 44th IEEE European Solid State Circuits Conference, ESSCIRC 2018 |
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Country/Territory | Germany |
City | Dresden |
Period | 3/09/18 → 6/09/18 |
Bibliographical note
Publisher Copyright:© 2018 IEEE.
Keywords
- Analog
- Hotspot
- Microprocessors
- Thermal Management
- Thermal Sensor