The aim of the study is to analyze the influence of heat load and structural parameters on junction temperature, temperature profiling and thermal resistance of laser diode stack. To know optimal structural parameters and temperature profiling, three dimensional steady and transient state thermal modeling of laser diode stack using Comsol software is carried out. The effect of pulse duration, heat load, submount height and thickness variation were studied to know the distribution of temperature along the whole structure of laser diode stack. Modeling study make it possible to design and select out the optimal values of structural parameters corresponding to the minimum thermal resistance of the structure. Results showed that the most important parameter of whole structure is thickness of CuW submount.
|Title of host publication
|The Physics of Semiconductor Devices - Proceedings of IWPSD 2017
|R.K. Sharma, D.S. Rawal
|Springer Science and Business Media, LLC
|Number of pages
|Published - 2019
|19th International Workshop on Physics of Semiconductor Devices, IWPSD 2017 - New Delhi, India
Duration: 11 Dec 2017 → 15 Dec 2017
|Springer Proceedings in Physics
|19th International Workshop on Physics of Semiconductor Devices, IWPSD 2017
|11/12/17 → 15/12/17
Bibliographical notePublisher Copyright:
© Springer Nature Switzerland AG 2019.