Thermal analysis of 3D associative processor

Leonid Yavits; Amir Morad; Ran Ginosar

Thermal analysis of 3D associative processor

Leonid Yavits, Amir Morad, Ran Ginosar

Bar-Ilan University - The Alexander Kofkin Faculty of Engineering

Research output: Working paper / Preprint › Preprint

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Abstract

Thermal density and hot spots limit three-dimensional (3D) implementation of massively-parallel SIMD processors and prohibit stacking DRAM dies above them. This study proposes replacing SIMD by an Associative Processor (AP). AP exhibits close to uniform thermal distribution with reduced hot spots. Additionally, AP may outperform SIMD processor when the data set size is sufficiently large, while dissipating less power. Comparative performance and thermal analysis supported by simulation confirm that AP might be preferable over SIMD for 3D implementation of large scale massively parallel processing engines combined with 3D DRAM integration.

Original language	Undefined/Unknown
State	Published - 15 Jul 2013

Bibliographical note

arXiv admin note: text overlap with arXiv:1306.3109

Keywords

cs.AR

Access to Document

1307.3853v1

Cite this

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