Abstract
This work studies the influence of temperature on performance and scalability of 3D Chip Multiprocessors (CMP) from Amdahl's law perspective. We find that 3D CMP may reach its thermal limit before reaching its maximum power. We show that a high level of parallelism may lead to high peak temperatures even in small scale 3D CMPs, thus limiting 3D CMP scalability and calling for different, in-memory computing architectures.
Original language | English |
---|---|
Article number | 7163568 |
Pages (from-to) | 2010-2013 |
Number of pages | 4 |
Journal | IEEE Transactions on Computers |
Volume | 65 |
Issue number | 6 |
DOIs | |
State | Published - 1 Jun 2016 |
Externally published | Yes |
Bibliographical note
Publisher Copyright:© 2015 IEEE.
Keywords
- 3D integrated circuits
- Amdahl's law
- Chip multiprocessor
- multicore
- thermal simulations