The Effect of Temperature on Amdahl Law in 3D Multicore Era

L. Yavits, A. Morad, R. Ginosar

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

This work studies the influence of temperature on performance and scalability of 3D Chip Multiprocessors (CMP) from Amdahl's law perspective. We find that 3D CMP may reach its thermal limit before reaching its maximum power. We show that a high level of parallelism may lead to high peak temperatures even in small scale 3D CMPs, thus limiting 3D CMP scalability and calling for different, in-memory computing architectures.

Original languageEnglish
Article number7163568
Pages (from-to)2010-2013
Number of pages4
JournalIEEE Transactions on Computers
Volume65
Issue number6
DOIs
StatePublished - 1 Jun 2016
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

Keywords

  • 3D integrated circuits
  • Amdahl's law
  • Chip multiprocessor
  • multicore
  • thermal simulations

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