TEMPO: Thermal-efficient management of power in high-throughput network switches

Tom Munk; Hillel Kugler; Ofir Maori; Adam Teman

doi:10.1109/VLSI-DAT.2019.8741684

TEMPO: Thermal-efficient management of power in high-throughput network switches

Tom Munk
, Hillel Kugler
, Ofir Maori
, Adam Teman

Bar-Ilan University - The Alexander Kofkin Faculty of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Communication rates of high-throughput network switches cause heat dissipation that can harm both performance and system reliability. Therefore, these systems integrate an aggressive cooling subsystem, often based on the operation of power-hungry fans at high-speeds to maintain a low ambient temperature. However, this may lead to both a high-degree of power waste and unacceptable acoustic levels. In this paper, we propose TEMPO, a thermal-efficient management scheme for system cooling with minimal fan power consumption and noise production, based on a straightforward, simple to apply algorithm. Tempo was applied to a Mellanox switch providing as much as a 30% power reduction and a 20% sound power reduction compared to the previously available commercial firmware.

Original language	English
Title of host publication	2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728106557
DOIs	https://doi.org/10.1109/VLSI-DAT.2019.8741684
State	Published - Apr 2019
Event	2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019 - Hsinchu, Taiwan, Province of China Duration: 22 Apr 2019 → 25 Apr 2019

Publication series

Name	2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019

Conference

Conference	2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019
Country/Territory	Taiwan, Province of China
City	Hsinchu
Period	22/04/19 → 25/04/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

Access to Document

10.1109/VLSI-DAT.2019.8741684

Cite this

Munk, T., Kugler, H., Maori, O., & Teman, A. (2019). TEMPO: Thermal-efficient management of power in high-throughput network switches. In 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019 Article 8741684 (2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/VLSI-DAT.2019.8741684

@inproceedings{350133cde9594ef287f39e1373eea31e,

title = "TEMPO: Thermal-efficient management of power in high-throughput network switches",

abstract = "Communication rates of high-throughput network switches cause heat dissipation that can harm both performance and system reliability. Therefore, these systems integrate an aggressive cooling subsystem, often based on the operation of power-hungry fans at high-speeds to maintain a low ambient temperature. However, this may lead to both a high-degree of power waste and unacceptable acoustic levels. In this paper, we propose TEMPO, a thermal-efficient management scheme for system cooling with minimal fan power consumption and noise production, based on a straightforward, simple to apply algorithm. Tempo was applied to a Mellanox switch providing as much as a 30\% power reduction and a 20\% sound power reduction compared to the previously available commercial firmware.",

author = "Tom Munk and Hillel Kugler and Ofir Maori and Adam Teman",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019 ; Conference date: 22-04-2019 Through 25-04-2019",

year = "2019",

month = apr,

doi = "10.1109/VLSI-DAT.2019.8741684",

language = "אנגלית",

series = "2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019",

address = "ארצות הברית",

}

Munk, T, Kugler, H, Maori, O & Teman, A 2019, TEMPO: Thermal-efficient management of power in high-throughput network switches. in 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019., 8741684, 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019, Institute of Electrical and Electronics Engineers Inc., 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019, Hsinchu, Taiwan, Province of China, 22/04/19. https://doi.org/10.1109/VLSI-DAT.2019.8741684

TEMPO: Thermal-efficient management of power in high-throughput network switches. / Munk, Tom; Kugler, Hillel; Maori, Ofir et al.
2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8741684 (2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - TEMPO

T2 - 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019

AU - Munk, Tom

AU - Kugler, Hillel

AU - Maori, Ofir

AU - Teman, Adam

PY - 2019/4

Y1 - 2019/4

N2 - Communication rates of high-throughput network switches cause heat dissipation that can harm both performance and system reliability. Therefore, these systems integrate an aggressive cooling subsystem, often based on the operation of power-hungry fans at high-speeds to maintain a low ambient temperature. However, this may lead to both a high-degree of power waste and unacceptable acoustic levels. In this paper, we propose TEMPO, a thermal-efficient management scheme for system cooling with minimal fan power consumption and noise production, based on a straightforward, simple to apply algorithm. Tempo was applied to a Mellanox switch providing as much as a 30% power reduction and a 20% sound power reduction compared to the previously available commercial firmware.

AB - Communication rates of high-throughput network switches cause heat dissipation that can harm both performance and system reliability. Therefore, these systems integrate an aggressive cooling subsystem, often based on the operation of power-hungry fans at high-speeds to maintain a low ambient temperature. However, this may lead to both a high-degree of power waste and unacceptable acoustic levels. In this paper, we propose TEMPO, a thermal-efficient management scheme for system cooling with minimal fan power consumption and noise production, based on a straightforward, simple to apply algorithm. Tempo was applied to a Mellanox switch providing as much as a 30% power reduction and a 20% sound power reduction compared to the previously available commercial firmware.

UR - https://www.scopus.com/pages/publications/85068619577

U2 - 10.1109/VLSI-DAT.2019.8741684

DO - 10.1109/VLSI-DAT.2019.8741684

M3 - ???researchoutput.researchoutputtypes.contributiontobookanthology.conference???

AN - SCOPUS:85068619577

T3 - 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019

BT - 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019

PB - Institute of Electrical and Electronics Engineers Inc.

Y2 - 22 April 2019 through 25 April 2019

ER -

Munk T, Kugler H, Maori O, Teman A. TEMPO: Thermal-efficient management of power in high-throughput network switches. In 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8741684. (2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019). doi: 10.1109/VLSI-DAT.2019.8741684

TEMPO: Thermal-efficient management of power in high-throughput network switches

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