TEMPO: Thermal-efficient management of power in high-throughput network switches

Tom Munk, Hillel Kugler, Ofir Maori, Adam Teman

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Communication rates of high-throughput network switches cause heat dissipation that can harm both performance and system reliability. Therefore, these systems integrate an aggressive cooling subsystem, often based on the operation of power-hungry fans at high-speeds to maintain a low ambient temperature. However, this may lead to both a high-degree of power waste and unacceptable acoustic levels. In this paper, we propose TEMPO, a thermal-efficient management scheme for system cooling with minimal fan power consumption and noise production, based on a straightforward, simple to apply algorithm. Tempo was applied to a Mellanox switch providing as much as a 30% power reduction and a 20% sound power reduction compared to the previously available commercial firmware.

Original languageEnglish
Title of host publication2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728106557
DOIs
StatePublished - Apr 2019
Event2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019 - Hsinchu, Taiwan, Province of China
Duration: 22 Apr 201925 Apr 2019

Publication series

Name2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019

Conference

Conference2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019
Country/TerritoryTaiwan, Province of China
CityHsinchu
Period22/04/1925/04/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

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