Structural health monitoring of solder joints in QFN package

I. Gershman, J. B. Bernstein

Research output: Contribution to journalArticlepeer-review

15 Scopus citations


QFN is very attractive package especially when it is used for power components. Its electrical and thermal performance turned this package to a very desirable for high speed and high power components. However the drawback of QFN package is its low reliability in applications that experience thermal cycles such as automotive and aerospace. A novel technique presented in this paper suggests a quantitative measurement tool for crack propagation in QFN solder-joints that could predict end-of-life of monitored joints. The technique that has been developed is based on serial ohmic resistance changes in solder joints as a function of crack propagation. A combination of mathematical model and measured data of solder-joints' ohmic resistance provides a structural health monitoring tool of QFN solder-joints. This could be used as a prognostic tool to remaining useful life of QFN package.

Original languageEnglish
Pages (from-to)3011-3016
Number of pages6
JournalMicroelectronics Reliability
Issue number12
StatePublished - Dec 2012


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