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Solder-joint quantitative crack analysis - Ohmic resistance approach
Israel Gershman
, Joseph B. Bernstein
Bar-Ilan University - The Alexander Kofkin Faculty of Engineering
Bar-Ilan University
Research output
:
Contribution to journal
›
Article
›
peer-review
12
Scopus citations
Overview
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Keyphrases
Solder Joint
100%
Ohmic Resistance
100%
Crack Analysis
100%
Analytical Model
66%
Crack Length
66%
Non-destructive
33%
Novel Technique
33%
Preventive Maintenance
33%
Temperature Cycle
33%
Daisy Chain
33%
Reliability Testing
33%
Lab Test
33%
Solder Joint Cracks
33%
Solder Joint Reliability
33%
Resistance Monitoring
33%
Prognostic Maintenance
33%
Efficient Testing
33%
Quad Flat No Leads
33%
Engineering
Joints (Structural Components)
100%
Ohmic Resistance
100%
Crack Length
33%
Analytical Model
33%
Early Stage
16%
Lab Test
16%
Test Time
16%
Test Vehicle
16%
Preventive Maintenance
16%