Solder-joint quantitative crack analysis - Ohmic resistance approach

Israel Gershman, Joseph B. Bernstein

Research output: Contribution to journalArticlepeer-review

8 Scopus citations


This paper presents a novel technique in the area of solder-joint reliability testing, suggesting a new approach for efficient testing of new products. An analytical model was developed relating the solder-joint ohmic resistance and the joint crack's length caused by temperature cycles. Based on the analytical model, a technique was developed allowing the measurement of a solder-joint's crack length in a nondestructive, continuous way. Thus, prediction of the solder-joint's end-of-life could be done at an early stage of the test, which substantially reduces the test time. This technique of resistance monitoring was validated with a commonly used test vehicle utilizing commercially off-the-shelf daisy-chain quad flat no-lead (QFN44) package. This method is not limited to lab tests, but rather is applicable also for prognostics and preventive maintenance in deployed products.

Original languageEnglish
Article number6177654
Pages (from-to)748-755
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number5
StatePublished - 2012


  • Crack
  • end-of-life
  • fatigue
  • quad flat no-lead (QFN)
  • solder-joint
  • thermal cycles


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