TY - JOUR
T1 - Small Signals' Study of Thermal Induced Current in Nanoscale SOI Sensor
AU - Mandelbaum, Yaakov
AU - Gadasi, Ilan
AU - Chelly, Avraham
AU - Zalevsky, Zeev
AU - Karsenty, Avi
N1 - Publisher Copyright:
© 2017 Yaakov Mandelbaum et al.
PY - 2017
Y1 - 2017
N2 - A new nanoscale SOI dual-mode modulator is investigated as a function of optical and thermal activation modes. In order to accurately characterize the device specifications towards its future integration in microelectronics circuitry, current time variations are studied and compared for "large signal" constant temperature changes, as well as for "small signal" fluctuating temperature sources. An equivalent circuit model is presented to define the parameters which are assessed by numerical simulation. Assuring that the thermal response is fast enough, the device can be operated as a modulator via thermal stimulation or, on the other hand, can be used as thermal sensor/imager. We present here the design, simulation, and model of the next generation which seems capable of speeding up the processing capabilities. This novel device can serve as a building block towards the development of optical/thermal data processing while breaking through the way to all optic processors based on silicon chips that are fabricated via typical microelectronics fabrication process.
AB - A new nanoscale SOI dual-mode modulator is investigated as a function of optical and thermal activation modes. In order to accurately characterize the device specifications towards its future integration in microelectronics circuitry, current time variations are studied and compared for "large signal" constant temperature changes, as well as for "small signal" fluctuating temperature sources. An equivalent circuit model is presented to define the parameters which are assessed by numerical simulation. Assuring that the thermal response is fast enough, the device can be operated as a modulator via thermal stimulation or, on the other hand, can be used as thermal sensor/imager. We present here the design, simulation, and model of the next generation which seems capable of speeding up the processing capabilities. This novel device can serve as a building block towards the development of optical/thermal data processing while breaking through the way to all optic processors based on silicon chips that are fabricated via typical microelectronics fabrication process.
UR - http://www.scopus.com/inward/record.url?scp=85042415580&partnerID=8YFLogxK
U2 - 10.1155/2017/1961734
DO - 10.1155/2017/1961734
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AN - SCOPUS:85042415580
SN - 1687-725X
VL - 2017
JO - Journal of Sensors
JF - Journal of Sensors
M1 - 1961734
ER -