Sharper and dipper laser beam shaping for super-resolved imaging in silicon

Maor Tiferet, Zeev Zalevsky, Moshe Sinvani

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Enhanced laser beam shaping for super-resolved imaging in silicon is demonstrated by applying pico-seconds pulsed pump at 775nm having increased penetration-depth into the silicon (than pump at 532nm) and yielding sharper PSF due to reduced diffusion effect of the generated free-charge-carriers.

Original languageEnglish
Title of host publicationComputational Optical Sensing and Imaging, COSI 2019
PublisherOptica Publishing Group (formerly OSA)
ISBN (Print)9781943580637
DOIs
StatePublished - 2019
EventComputational Optical Sensing and Imaging, COSI 2019 - Munich, Germany
Duration: 24 Jun 201927 Jun 2019

Publication series

NameOptics InfoBase Conference Papers
VolumePart F170-COSI 2019
ISSN (Electronic)2162-2701

Conference

ConferenceComputational Optical Sensing and Imaging, COSI 2019
Country/TerritoryGermany
CityMunich
Period24/06/1927/06/19

Bibliographical note

Publisher Copyright:
© OSA 2019 © 2019 The Author(s)

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