Self-assembled monolayer assisted bonding of Si and InP

I. Bakish, V. Artel, T. Ilovitsh, M. Shubely, Y. Ben-Ezra, Avinoam Zadok, C. N. Sukenik

Research output: Contribution to journalArticlepeer-review

15 Scopus citations


A versatile procedure for the low-temperature bonding of silicon and indium-phosphide to silicon is proposed and demonstrated. The procedure relies on the deposition and functionalization of self-assembled, single molecular layers on the surface of one substrate, and the subsequent attachment of the monolayer to the surface of the other substrate with or without its own monolayer coating. The process is applicable to the fabrication of hybrid-silicon, active photonic devices.

Original languageEnglish
Pages (from-to)1141-1148
Number of pages8
JournalOptical Materials Express
Issue number8
StatePublished - Aug 2012


Dive into the research topics of 'Self-assembled monolayer assisted bonding of Si and InP'. Together they form a unique fingerprint.

Cite this