Abstract
In this paper, we have examined the particulate removal efficiency of a laser from solid surfaces. The silicon wafers were contaminated with 0.05 to 0.5 μm sized alumina particles. The silicon wafers with uniform surface-distribution of alumina particles were subjected to pulsed laser beams at varying conditions. The results obtained have shown that line beam lasers can remove submicron particles more efficiently from solid surfaces. The mechanism responsible for higher particulate removal-efficiency of line beam laser has also been discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 1104-1106 |
| Number of pages | 3 |
| Journal | Journal of Electronic Materials |
| Volume | 27 |
| Issue number | 10 |
| DOIs | |
| State | Published - Oct 1998 |
| Externally published | Yes |
Funding
The funding for this research was made available from National Science Foundation through the Engi- neering Research Center for Particle Science & Technology at the University of Florida (grant number DE-FG 05-95ER45533). The authors are also thankful to Professor B.M. Moudgil for very helpful discussions.
| Funders | Funder number |
|---|---|
| National Science Foundation | |
| University of Florida | DE-FG 05-95ER45533 |
Keywords
- Alumina
- Line-beam
- Particulate cleaning
- Pulsed laser
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