Abstract
Recrystallization of amorphous silicon has been investigated using conventional furnace annealing, incoherent light-based rapid thermal annealing (RTA) and pulsed laser annealing using excimer laser (wavelength = 248 nm, energy density = 0.1-0.6 J/cm2) at a pulse width of approximately 20 nanoseconds. The effects of annealing methods are characterized for grain growth and crystallized orientation using transmission electron microscopy (TEM) and X-ray diffraction analysis. The various recrystallization methods are compared based on the structural properties of the resulting film and optimized thermal budgets for each heating mechanism are discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 297-302 |
| Number of pages | 6 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 342 |
| DOIs | |
| State | Published - 1994 |
| Externally published | Yes |
| Event | Proceedings of the 1994 Spring Meeting of the Materials Research Society - San Francisco, CA, USA Duration: 4 Apr 1994 → 7 Apr 1994 |
Fingerprint
Dive into the research topics of 'Recrystallization of amorphous silicon using rapid thermal processing, laser annealing and furnace heating'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver