Quantitative analyses of power loss mechanisms in semiconductor devices by thermal wave calorimetry

Bettine Büchner; Martin Wolf; David Cahen

doi:10.1016/0921-5093(89)90784-3

Quantitative analyses of power loss mechanisms in semiconductor devices by thermal wave calorimetry

Bettine Büchner
, Martin Wolf
, David Cahen

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

Photothermal and electrothermal measurements are used as a calorimetric method to study power dissipation in semiconductor devices as a function of applied bias. We have developed a model that allows a quantitative determination of the contributions due to the major heat-generating mechanisms which are responsible for conversion losses in different types of illuminated and non-illuminated photovoltaic cells and laser diodes.

Original language	English
Pages (from-to)	127-131
Number of pages	5
Journal	Materials Science and Engineering: A
Volume	122
Issue number	1
DOIs	https://doi.org/10.1016/0921-5093(89)90784-3
State	Published - 10 Dec 1989
Externally published	Yes

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10.1016/0921-5093(89)90784-3

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abstract = "Photothermal and electrothermal measurements are used as a calorimetric method to study power dissipation in semiconductor devices as a function of applied bias. We have developed a model that allows a quantitative determination of the contributions due to the major heat-generating mechanisms which are responsible for conversion losses in different types of illuminated and non-illuminated photovoltaic cells and laser diodes.",

author = "Bettine B{\"u}chner and Martin Wolf and David Cahen",

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AB - Photothermal and electrothermal measurements are used as a calorimetric method to study power dissipation in semiconductor devices as a function of applied bias. We have developed a model that allows a quantitative determination of the contributions due to the major heat-generating mechanisms which are responsible for conversion losses in different types of illuminated and non-illuminated photovoltaic cells and laser diodes.

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Quantitative analyses of power loss mechanisms in semiconductor devices by thermal wave calorimetry

Abstract

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