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Pump induced particle agglomeration during CMP of metal and dielectrics
F. C. Chang
, Rajiv Singh
University of Florida
Research output
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Contribution to conference
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peer-review
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Keyphrases
Dielectric
100%
Particle Agglomeration
100%
Defectivity
100%
Slurry
75%
Particle Distribution
50%
Colloidal Particles
25%
Shear Flow
25%
Handling Process
25%
Polishing Process
25%
Low-k Dielectric
25%
Positive Displacement Pump
25%
Slurry Handling
25%
Ceria Particle
25%
CMP Slurry
25%
Low-k Materials
25%
Slurry Composition
25%
Shear Effect
25%
Material Science
Dielectric Material
100%
Particle Agglomeration
100%
Cerium Oxide
33%
Shear Flow
33%
Pharmacology, Toxicology and Pharmaceutical Science
Cytidine Phosphate
100%
Colloidal Particle
25%
Cerium Oxide
25%