Keyphrases
Silicon Dioxide
100%
Silicon Nitride
100%
Chemical Mechanical Polishing
100%
Single-crystalline
100%
Ceria Abrasive
100%
Polishing Behaviour
100%
Abrasive Size
75%
Oxide Film
50%
Removal Rate
50%
Polishing Process
50%
Nitride Films
50%
Silica
25%
Reaction Conditions
25%
Hydrothermal Reaction
25%
Mechanical Force
25%
Morphological Properties
25%
Slurry
25%
Abrasive
25%
Ceria
25%
Primary Particle Size
25%
Polishing Slurry
25%
Abrasive Particles
25%
Removal Selectivity
25%
Surface Uniformity
25%
Material Science
Crystalline Material
100%
Silicon Nitride
100%
Silicon Dioxide
100%
Cerium Oxide
100%
Chemical Mechanical Planarization
100%
Film
33%
Nitride Compound
33%
Oxide Compound
33%
Hydrothermal Synthesis
16%
Morphology
16%
Engineering
Chemical Mechanical Polishing
100%
Abrasive
100%
Nitride
100%
Abrasive Size
75%
Polishing Process
50%
Removal Rate
50%
Hydrothermal Synthesis
25%
Size of Particle
25%
Mechanical Force
25%
Polishing Slurry
25%
Abrasive Particle
25%
Silicon Dioxide (Sio2)
25%
Chemical Engineering
Cerium Compound
100%
Silica
100%
Silicon Nitride
100%
Nitride
40%