Abstract
A new photoelectrochemical etching process is described for n-type 6H-SiC, while dark electrochemistry has been used to pattern p-type material. In this two-step etching process, the SIC is first anodized to form a deep porous layer, and this layer is subsequently removed by thermal oxidation followed by an HF dip. Etch rates as high as 4000 Å/min for n-SiC and 2.2 µm/min for p-SiC have been obtained during the anodization, resulting in near mirror-like etched surfaces.
Original language | English |
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Pages (from-to) | 778-781 |
Number of pages | 4 |
Journal | Journal of the Electrochemical Society |
Volume | 141 |
Issue number | 3 |
DOIs | |
State | Published - Mar 1994 |
Externally published | Yes |