Optimized features allocation technique for improved automated alignment of wafers

Michael Parshin; Zeev Zalevsky

doi:10.1117/12.804728

Optimized features allocation technique for improved automated alignment of wafers

Michael Parshin, Zeev Zalevsky

Bar-Ilan University

Research output: Contribution to journal › Conference article › peer-review

Abstract

In this paper we present a new fuzzy logic based approach for automatic optimized features allocation. The technique is used for improved automatic alignment and classification of silicon wafers and chips that are used in the electronic industry. The proposed automatic image processing approach was realized and experimentally demonstrated in real industrial application with typical wafers. The automatic features allocation and grading supported the industrial requirements and could replace human expert based inspection that currently is performed manually.

Original language	English
Article number	72510V
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	7251
DOIs	https://doi.org/10.1117/12.804728
State	Published - 2009
Event	Image Processing: Machine Vision Applications II - San Jose, CA, United States Duration: 20 Jan 2009 → 22 Jan 2009

Keywords

Fuzzy logic
Image evaluation
Image processing

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10.1117/12.804728

Cite this

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abstract = "In this paper we present a new fuzzy logic based approach for automatic optimized features allocation. The technique is used for improved automatic alignment and classification of silicon wafers and chips that are used in the electronic industry. The proposed automatic image processing approach was realized and experimentally demonstrated in real industrial application with typical wafers. The automatic features allocation and grading supported the industrial requirements and could replace human expert based inspection that currently is performed manually.",

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Optimized features allocation technique for improved automated alignment of wafers

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Keywords

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