Optimized features allocation technique for improved automated alignment of wafers

Michael Parshin, Zeev Zalevsky

Research output: Contribution to journalConference articlepeer-review


In this paper we present a new fuzzy logic based approach for automatic optimized features allocation. The technique is used for improved automatic alignment and classification of silicon wafers and chips that are used in the electronic industry. The proposed automatic image processing approach was realized and experimentally demonstrated in real industrial application with typical wafers. The automatic features allocation and grading supported the industrial requirements and could replace human expert based inspection that currently is performed manually.

Original languageEnglish
Article number72510V
JournalProceedings of SPIE - The International Society for Optical Engineering
StatePublished - 2009
EventImage Processing: Machine Vision Applications II - San Jose, CA, United States
Duration: 20 Jan 200922 Jan 2009


  • Fuzzy logic
  • Image evaluation
  • Image processing


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