Abstract
We report here on the optimization of ohmic contacts to p-CuInSe2 (CISe) single crystals. A low resistance ohmic contact is required to minimize current losses due to series resistance; e.g. in Schottky diodes. Both In-Ga (eutectic)/CISe and gold (evaporatedVCISe contacts have been fabricated on crystals with different orientations and bulk properties. Gold contacts were found to have a lower resistance and to be more stable than In-Ga ones, from the slope of the linear current-voltage plot of the junctions. The resistance of the Au/CISe ohmic contact was decreased by etching the CISe crystal surface chemically in a 0.5% solution of Br2 in methanol for 30 sec at room temperature, prior to gold deposition, while that of the In-Ga contact increased by this etch. Wetting experiments and contact angle measurements showed evidence for changes in the polarity of the surface due to chemical etches.
| Original language | English |
|---|---|
| Pages (from-to) | 275-280 |
| Number of pages | 6 |
| Journal | Journal of Electronic Materials |
| Volume | 22 |
| Issue number | 3 |
| DOIs | |
| State | Published - Mar 1993 |
| Externally published | Yes |
Keywords
- Chemical etch
- CuInSe
- I-V characteristics
- contact angle
- metal-semiconductor
- ohmic contact
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