Novel reactive chemical mechanical polishing technology for fabrication of SiC mirrors

Rajiv K. Singh, Arul Chakkaravarthi Arjunan, Kannan Balasundaram, Puneet Jawali, George Ling, Deepika Singh, William Everson

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

A new reactive chemical mechanical polishing process has been developed and optimized for polishing CVD SiC mirror samples. The studies show that the abrasives, chemical nature of the slurry, and other additives play an important role in the material removal rate and surface finish of the SiC mirror. The use of different abrasive types and sizes resulted in differing roughness and removal rates. The smaller abrasives created surface defectivity or higher roughness. This can be explained by different polishing rates of different orientations of SiC grains, resulting in the grain enhancement. Under optimal conditions with appropriate abrasive particles, roughness RMS as low as 0.2 nm was achieved on CVD SiC samples. The process also did not show any scratch-like features in the optical interferometry measurements.

Original languageEnglish
Title of host publicationMaterial Technologies and Applications to Optics, Structures, Components, and Sub-Systems
DOIs
StatePublished - 2013
Externally publishedYes
Event2013 Conference on Material Technologies and Applications to Optics, Structures, Components, and Sub-Systems - San Diego, CA, United States
Duration: 26 Aug 201328 Aug 2013

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume8837
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

Conference2013 Conference on Material Technologies and Applications to Optics, Structures, Components, and Sub-Systems
Country/TerritoryUnited States
CitySan Diego, CA
Period26/08/1328/08/13

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