Nondestructive quantitative analysis has been developed and can reduce solder joint fatigue experiments by half the time. Additionally, the technique provides data that could shed some light on the dynamic behavior of solder joints under thermal cycles load. Statistical analysis of fatigue cracks' characteristics was performed based on solder joints that were monitored continuously during more than a thousand temperature cycles of-40/125 °C. This paper presents the statistical analyses of solder joint and crack characteristics. A novel comparative criterion that was developed based on the nondestructive quantitative analysis of crack propagation in solder joints (NDQC) technique and presented here could be utilized in development stages of new technologies and save even more than 50% of testing time.
|Number of pages
|IEEE Transactions on Components, Packaging and Manufacturing Technology
|Published - 2013
- solder joint
- thermal cycles