Nondestructive quantitative analysis of crack propagation in solder joints

Israel Gershman, Joseph B. Bernstein

Research output: Contribution to journalArticlepeer-review

2 Scopus citations


Nondestructive quantitative analysis has been developed and can reduce solder joint fatigue experiments by half the time. Additionally, the technique provides data that could shed some light on the dynamic behavior of solder joints under thermal cycles load. Statistical analysis of fatigue cracks' characteristics was performed based on solder joints that were monitored continuously during more than a thousand temperature cycles of-40/125 °C. This paper presents the statistical analyses of solder joint and crack characteristics. A novel comparative criterion that was developed based on the nondestructive quantitative analysis of crack propagation in solder joints (NDQC) technique and presented here could be utilized in development stages of new technologies and save even more than 50% of testing time.

Original languageEnglish
Article number6424015
Pages (from-to)1263-1270
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number8
StatePublished - 2013


  • Crack
  • fatigue
  • propagation
  • solder joint
  • thermal cycles


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