Nondestructive contact deposition for molecular electronics: Si-alkyl//au junctions

Keyphrases

• Lift-off 100%
• Molecular Electronics 100%
• Non-destructive 100%
• Alkyl 100%
• Polymer-assisted 75%
• Thin Elements 50%
• Metal Leaf 50%
• Monolayer Semiconductors 50%
• Organic Monolayers 50%
• Metal-organic Materials 50%
• Lithography 25%
• Current-voltage Characteristics 25%
• Electrical Performance 25%
• Molecular Layer 25%
• Molecular Degradation 25%
• Punching 25%
• Multiple Contacts 25%
• Biomolecules 25%
• Morphological Characterization 25%
• Function Area 25%
• Metal Cans 25%
• Modified Polymer 25%
• Highly Uniform 25%
• Semiconductor Devices 25%
• Work Contact 25%
• Contact Area 25%
• Metal Work Function 25%
• Metal Penetration 25%
• Wrinkle-free 25%
• Semiconductor Junctions 25%
• Simultaneous Deposition 25%
• Deposition Methods 25%
• Molecular Metal 25%

Engineering

• Monolayer 100%
• Molecular Electronics 100%
• Biomolecule 50%
• Deposition Method 50%
• Contact Area 50%
• Semiconductor Device 50%
• Major Problem 50%
• Limitations 50%
• Electrical Performance 50%
• Molecular Layer 50%
• Lithography 50%
• Current-Voltage Characteristic 50%

Material Science

• Monolayers 100%
• Current Voltage Characteristics 50%
• Lithography 50%
• Contact Area 50%
• Semiconductor Device 50%
• Morphology 50%