Niobium Nitride Thin Films for Very Low Temperature Resistive Thermometry

Tuyen Nguyen; Adib Tavakoli; Sebastien Triqueneaux; Rahul Swami; Aki Ruhtinas; Jeremy Gradel; Pablo Garcia-Campos; Klaus Hasselbach; Aviad Frydman; Benjamin Piot; Mathieu Gibert; Eddy Collin; Olivier Bourgeois

doi:10.1007/s10909-019-02222-6

Niobium Nitride Thin Films for Very Low Temperature Resistive Thermometry

Tuyen Nguyen
, Adib Tavakoli
, Sebastien Triqueneaux
, Rahul Swami
, Aki Ruhtinas
, Jeremy Gradel
, Pablo Garcia-Campos
, Klaus Hasselbach
, Aviad Frydman
, Benjamin Piot
, Mathieu Gibert
, Eddy Collin
, Olivier Bourgeois

Department of Physics - at Bar-Ilan University

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

Abstract

We investigate thin-film resistive thermometry based on metal-to-insulator transition (niobium nitride) materials down to very low temperature. The variation of the NbN thermometer resistance has been calibrated versus temperature and magnetic field. High sensitivity in temperature variation detection is demonstrated through efficient temperature coefficient of resistance. The nitrogen content of the niobium nitride thin films can be tuned to adjust the optimal working temperature range. In the present experiment, we show the versatility of the NbN thin-film technology through applications in very different low-temperature use cases. We demonstrate that thin-film resistive thermometry can be extended to temperatures below 30 mK with low electrical impedance.

Original language	English
Pages (from-to)	348-356
Number of pages	9
Journal	Journal of Low Temperature Physics
Volume	197
Issue number	5-6
DOIs	https://doi.org/10.1007/s10909-019-02222-6
State	Published - 1 Dec 2019

Bibliographical note

Publisher Copyright:
© 2019, Springer Science+Business Media, LLC, part of Springer Nature.

Funding

We thank the micro- and nanofabrication facilities of Institut Néel CNRS: the Pôle Capteurs Thermométriques et Calorimétrie, Nanofab for their help in the preparation of the samples and the experiments. We have also benefited from the support of the Pole Cryogenie and Pole Electronique. The research leading to these results has received funding from the European Union’s Horizon 2020 Research and Innovation Programme, under Grant Agreement No. 824109, the European Microkelvin Platform (EMP), the EU project MERGING Grant No. 309150, ERC CoG Grant ULT-NEMS No. 647917; the authors also acknowledge the financial support from the ANR Project QNM Grant No. 040401, the Laboratoire d’excellence LANEF in Grenoble (ANR-10-LABX-51-01), the ANR project Tiptop ANR-16-CE09-0023; PDG acknowledges funding from Innovation Programme under the Marie Skłodowska-Curie Grant Agreement No. 754303 and the Fondation des Nanosciences (FCSN 2018 02D), and AR from Erasmus EU programme.

Funders	Funder number
Erasmus EU
Laboratoire d’excellence LANEF
Marie Skłodowska-Curie
Fondation Nanosciences	FCSN 2018 02D
Horizon 2020 Framework Programme	309150, 824109, 647917, 754303
European Commission
European Commission	040401, ANR-16-CE09-0023, ANR-10-LABX-51-01

Keywords

Nanoscale
Niobium nitride
Resistive thermometry
Thin film

Access to Document

10.1007/s10909-019-02222-6

Cite this

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abstract = "We investigate thin-film resistive thermometry based on metal-to-insulator transition (niobium nitride) materials down to very low temperature. The variation of the NbN thermometer resistance has been calibrated versus temperature and magnetic field. High sensitivity in temperature variation detection is demonstrated through efficient temperature coefficient of resistance. The nitrogen content of the niobium nitride thin films can be tuned to adjust the optimal working temperature range. In the present experiment, we show the versatility of the NbN thin-film technology through applications in very different low-temperature use cases. We demonstrate that thin-film resistive thermometry can be extended to temperatures below 30 mK with low electrical impedance.",

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AU - Gradel, Jeremy

AU - Garcia-Campos, Pablo

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Niobium Nitride Thin Films for Very Low Temperature Resistive Thermometry

Abstract

Bibliographical note

Funding

Keywords

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