Nanosized CuO Encapsulated Silica Particles Using an Electrochemical Deposition Coating

Han Ho Choi, Joodong Park, R. K. Singh

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

An electrochemical deposition coating method was developed to encapsulate submicrometer sized silica particles with nanosized CuO particles. The particle size of the as-synthesized CuO particles was estimated to be below 10 nm from X-ray powder diffraction and transmission electron microscopy (TEM). The thickness of the coating layer measured using TEM ranged from a few nanometers to about 20 nm. The optical absorption spectrum exhibited evidence of formation of CuO nanocrystals with dimensions on the order of a few nanometers as a result of the quantum confinement effect. Zeta potential analysis also proved the presence of CuO coating layer and full, surface coverage of the silica particles.

Original languageEnglish
Pages (from-to)C10-C12
JournalElectrochemical and Solid-State Letters
Volume7
Issue number1
DOIs
StatePublished - 2004
Externally publishedYes

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