Multi-view kernel-based data analysis

Amir Averbuch, Moshe Salhov, Ofir Lindenbaum, Avi Silberschatz, Yoel Shkolnisky

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The input data features set for many data driven tasks is high-dimensional while the intrinsic dimension of the data is low. Data analysis methods aim to uncover the underlying low dimensional structure imposed by the low dimensional hidden parameters by utilizing distance metrics that considers the set of attributes as a single monolithic set. However, the transformation of the low dimensional phenomena into the measured high dimensional observations might distort the distance metric. This distortion can affect the desired estimated low dimensional geometric structure. In this paper, we suggest to utilize the redundancy in the feature domain by partitioning the features into multiple subsets that are called views. The proposed method utilize the agreement also called consensus between different views to extract valuable geometric information that unifies multiple views about the intrinsic relationships among several different observations. This unification enhances the information that a single view or a simple concatenations of views provides.

Original languageEnglish
Title of host publication2016 IEEE International Conference on the Science of Electrical Engineering, ICSEE 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509021529
DOIs
StatePublished - 4 Jan 2017
Externally publishedYes
Event2016 IEEE International Conference on the Science of Electrical Engineering, ICSEE 2016 - Eilat, Israel
Duration: 16 Nov 201618 Nov 2016

Publication series

Name2016 IEEE International Conference on the Science of Electrical Engineering, ICSEE 2016

Conference

Conference2016 IEEE International Conference on the Science of Electrical Engineering, ICSEE 2016
Country/TerritoryIsrael
CityEilat
Period16/11/1618/11/16

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

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