Modular microprinting with optical & acoustic fields

Original language	American English
State	Published - 2020
Event	US-Israel Emerging Technologies meeting - , United States Duration: 1 Jan 2020 → 1 Jan 2020

Conference

Conference	US-Israel Emerging Technologies meeting
Country/Territory	United States
Period	1/01/20 → 1/01/20

Activities

• 1 Invited talk

Activities per year

• Conference Invited

  Shpizman, H. (Invited speaker)

  1 Jan 2020

  Activity: Talk or presentation › Invited talk

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Shpaisman, H. (2020). Modular microprinting with optical & acoustic fields. Paper presented at US-Israel Emerging Technologies meeting, United States.

Shpaisman, H. / Modular microprinting with optical & acoustic fields. Paper presented at US-Israel Emerging Technologies meeting, United States.

@conference{8a60507af37a4d5d9e130428c7a1feca,

title = "Modular microprinting with optical & acoustic fields",

author = "H. Shpaisman",

year = "2020",

language = "American English",

note = "US-Israel Emerging Technologies meeting ; Conference date: 01-01-2020 Through 01-01-2020",

}

Shpaisman, H 2020, 'Modular microprinting with optical & acoustic fields', Paper presented at US-Israel Emerging Technologies meeting, United States, 1/01/20 - 1/01/20.

Modular microprinting with optical & acoustic fields. / Shpaisman, H.
2020. Paper presented at US-Israel Emerging Technologies meeting, United States.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - Modular microprinting with optical & acoustic fields

AU - Shpaisman, H.

PY - 2020

Y1 - 2020

M3 - Paper

T2 - US-Israel Emerging Technologies meeting

Y2 - 1 January 2020 through 1 January 2020

ER -

Shpaisman H. Modular microprinting with optical & acoustic fields. 2020. Paper presented at US-Israel Emerging Technologies meeting, United States.