Modelling of Impurity Transport and Plasma–Wall Interaction in Fusion Devices with the ERO Code: Basics of the Code and Examples of Application

A. Kirschner, D. Tskhakaya, G. Kawamura, D. Borodin, S. Brezinsek, R. Ding, Ch Linsmeier, J. Romazanov

Research output: Contribution to journalArticlepeer-review

26 Scopus citations

Abstract

The 3D ERO code, which simulates plasma–wall interaction and impurity transport in magnetically confined fusion-relevant devices is described. As application, prompt deposition of eroded tungsten has been simulated at surfaces with shallow magnetic field of 3 T. Dedicated PIC simulations have been performed to calculate the characteristics of the sheath in front of plasma–exposed surfaces to use as input for these ERO simulations. Prompt deposition of tungsten reaches 100% at the highest electron temperature and density. In comparison to more simplified assumptions for the sheath the amount of prompt deposition is in general smaller if the PIC–calculated sheath is used. Due to friction with the background plasma the impact energy of deposited tungsten can be significantly larger than the energy gained in the sheath potential.

Original languageEnglish
Pages (from-to)622-627
Number of pages6
JournalContributions to Plasma Physics
Volume56
Issue number6-8
DOIs
StatePublished - 1 Aug 2016
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 2016 The Authors. Contributions to Plasma Physics published by Wiley-VCH Verlag GmbH & Co. KGaA Weinheim. This is an open access article under the terms of the Creative Commons Attribution License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited.

Keywords

  • ERO
  • Fusion research
  • PIC
  • erosion
  • plasma−wall interaction
  • prompt deposition

Fingerprint

Dive into the research topics of 'Modelling of Impurity Transport and Plasma–Wall Interaction in Fusion Devices with the ERO Code: Basics of the Code and Examples of Application'. Together they form a unique fingerprint.

Cite this