TY - JOUR
T1 - Microlens array fabrication by chemical mechanical polishing
AU - Kumar, Purushottam
AU - Son, Seung Young
AU - Lee, Jaeseok
AU - Chang, Feng Chi
AU - Khanna, Aniruddh
AU - Chakkaravarthi Arjunan, Arul
AU - Singh, Rajiv K.
PY - 2009
Y1 - 2009
N2 - Chemical mechanical polishing (CMP) was used to shape hexagonally arranged 20 μm diam cone-shaped structures, prepared by wet etching of Corning 2496 glass, into microlenses. Edge rounding, which occurs during CMP due to a higher removal rate at the edges, was utilized for shaping of the microlenses. Microlenses with an H/D ratio of ∼1/10 and radius of curvature of 27.5 μm were obtained. CMP variables that affect the contact pressure and material removal rate are downpressure, linear velocity, slurry, and properties of the pad. These variables being external to substrate provide great flexibility and, hence, suitability of the process for a wide range of materials.
AB - Chemical mechanical polishing (CMP) was used to shape hexagonally arranged 20 μm diam cone-shaped structures, prepared by wet etching of Corning 2496 glass, into microlenses. Edge rounding, which occurs during CMP due to a higher removal rate at the edges, was utilized for shaping of the microlenses. Microlenses with an H/D ratio of ∼1/10 and radius of curvature of 27.5 μm were obtained. CMP variables that affect the contact pressure and material removal rate are downpressure, linear velocity, slurry, and properties of the pad. These variables being external to substrate provide great flexibility and, hence, suitability of the process for a wide range of materials.
UR - http://www.scopus.com/inward/record.url?scp=69149110751&partnerID=8YFLogxK
U2 - 10.1149/1.3065966
DO - 10.1149/1.3065966
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AN - SCOPUS:69149110751
SN - 1099-0062
VL - 12
SP - H269-H271
JO - Electrochemical and Solid-State Letters
JF - Electrochemical and Solid-State Letters
IS - 7
ER -