Abstract
In chemical mechanical polishing (CMP) systems, slurry stability is qualitatively assessed through interparticle force or zeta potential measurements. However, these types of measurements do not fully describe agglomeration phenomena in CMP slurries. Therefore, we developed an experimentaltheoretical approach for quantifying the degree of agglomeration in CMP slurries. This method involves subjecting the slurry to high-shear forces and measuring particle agglomeration characteristics in their tail distribution. By modeling changes in tail distribution using Smoluchowski's slow aggregation theory, the agglomeration index can be used to quantify the degree of agglomeration caused by external shear stress and internal slurry chemistry.
Original language | English |
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Pages (from-to) | H127-H130 |
Journal | Electrochemical and Solid-State Letters |
Volume | 12 |
Issue number | 4 |
DOIs | |
State | Published - 2009 |
Externally published | Yes |