TY - CHAP
T1 - Magnetolithography
T2 - From the bottom-up route to high throughput
AU - Bardea, Amos
AU - Naaman, Ron
PY - 2010
Y1 - 2010
N2 - Magnetolithography (ML), a technology for patterning surfaces, is a single-step process, and is much simpler and less expensive to apply than the common photolithography method. ML does not require application of resists, and therefore, the surfaces remain clean and can be easily modified chemically as needed. ML also not depends on the surface topography and planarity and can be used for patterning non-flat and the inside surfaces of a closed volume. The widths of lines made with ML can actually be smaller than the lines on the mask used. ML uses backside lithography, which can easily produce multilayers with highly accurate alignment and with the same efficiency for all layers. Positive and negative ML can be applied to a wide range of surfaces for patterning with either small or large molecules or biomolecules sensitive to the chemical environment. ML method can be used for chemical patterning and also for common microelectronic processes such as etching, deposition, and ion implant.
AB - Magnetolithography (ML), a technology for patterning surfaces, is a single-step process, and is much simpler and less expensive to apply than the common photolithography method. ML does not require application of resists, and therefore, the surfaces remain clean and can be easily modified chemically as needed. ML also not depends on the surface topography and planarity and can be used for patterning non-flat and the inside surfaces of a closed volume. The widths of lines made with ML can actually be smaller than the lines on the mask used. ML uses backside lithography, which can easily produce multilayers with highly accurate alignment and with the same efficiency for all layers. Positive and negative ML can be applied to a wide range of surfaces for patterning with either small or large molecules or biomolecules sensitive to the chemical environment. ML method can be used for chemical patterning and also for common microelectronic processes such as etching, deposition, and ion implant.
UR - http://www.scopus.com/inward/record.url?scp=78649917979&partnerID=8YFLogxK
U2 - 10.1016/B978-0-12-381312-1.00001-8
DO - 10.1016/B978-0-12-381312-1.00001-8
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AN - SCOPUS:78649917979
T3 - Advances in Imaging and Electron Physics
SP - 1
EP - 27
BT - Advances in Imaging and Electron Physics
PB - Academic Press Inc.
ER -