Lower Temperature Curing Thermoset Polyimides Utilizing a Substituted Norbornene Endcap

John F. Waters, Chaim N. Sukenik, Vance O. Kennedy, Mordechai Livneh, Wiley J. Youngs, James K. Sutter, Mary Ann B. Meador, Luke A. Burke, Myong K. Ahn

Research output: Contribution to journalArticlepeer-review

10 Scopus citations


Methoxycarbonyl bridgehead substituted nadic diacid monomethyl ester, when used as an endcapping monomer, lowered the cure temperature of thermoset PMR polyimides without seriously affecting other desirable properties, such as glass transition temperature and thermal oxidative stability. The 13C CP/MAS NMR of model compounds was used to follow the cure of resin systems using both the unmodified nadic endcap and the methoxycarbonyl-substituted endcap. Rheological analysis and differential scanning calorimetry (DSC) also provided evidence for the lower curing nature of the substituted endcap. Two regioisomers of the bridgehead-substituted endcap were isolated, and their chemical structures were elucidated by X-ray crystallography. The model compound and molecular modeling studies conducted ruled out the possibility of regioisomeric imide formation in the substituted endcaps.

Original languageEnglish
Pages (from-to)3868-3873
Number of pages6
Issue number15
StatePublished - 1 Jul 1992
Externally publishedYes


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