Low temperature wafer bonding of silicon to InP and silicon to LiNbO3 using self-assembled monolayers

V. Artel; I. Bakish; T. Kraus; M. Shubely; Y. Ben-Ezra; E. Shekel; S. Zach; A. Zadok; C. N. Sukenik

Low temperature wafer bonding of silicon to InP and silicon to LiNbO₃ using self-assembled monolayers

V. Artel, I. Bakish, T. Kraus, M. Shubely, Y. Ben-Ezra, E. Shekel, S. Zach, A. Zadok, C. N. Sukenik

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Procedures for wafer bonding between silicon and InP and between silicon and LiNbO₃ at temperatures below 120 °C are reported. The bonding is based on the deposition of functionalized, organic self assembled monolayers.

Original language	English
Title of host publication	Optical Fiber Communication Conference, OFC 2012
State	Published - 2012
Event	Optical Fiber Communication Conference, OFC 2012 - Los Angeles, CA, United States Duration: 4 Mar 2012 → 8 Mar 2012

Publication series

Name	Optics InfoBase Conference Papers
ISSN (Electronic)	2162-2701

Conference

Conference	Optical Fiber Communication Conference, OFC 2012
Country/Territory	United States
City	Los Angeles, CA
Period	4/03/12 → 8/03/12

Bibliographical note

Place of conference:Los Angeles, California United States

Cite this

@inproceedings{20a6e20dd8974736a0b1285343a0c399,

title = "Low temperature wafer bonding of silicon to InP and silicon to LiNbO3 using self-assembled monolayers",

abstract = "Procedures for wafer bonding between silicon and InP and between silicon and LiNbO3 at temperatures below 120 °C are reported. The bonding is based on the deposition of functionalized, organic self assembled monolayers.",

author = "V. Artel and I. Bakish and T. Kraus and M. Shubely and Y. Ben-Ezra and E. Shekel and S. Zach and A. Zadok and Sukenik, {C. N.}",

note = "Place of conference:Los Angeles, California United States; Optical Fiber Communication Conference, OFC 2012 ; Conference date: 04-03-2012 Through 08-03-2012",

year = "2012",

language = "אנגלית",

isbn = "9781557529381",

series = "Optics InfoBase Conference Papers",

booktitle = "Optical Fiber Communication Conference, OFC 2012",

}

Artel, V, Bakish, I, Kraus, T, Shubely, M, Ben-Ezra, Y, Shekel, E, Zach, S, Zadok, A & Sukenik, CN 2012, Low temperature wafer bonding of silicon to InP and silicon to LiNbO₃ using self-assembled monolayers. in Optical Fiber Communication Conference, OFC 2012. Optics InfoBase Conference Papers, Optical Fiber Communication Conference, OFC 2012, Los Angeles, CA, United States, 4/03/12.

TY - GEN

T1 - Low temperature wafer bonding of silicon to InP and silicon to LiNbO3 using self-assembled monolayers

AU - Artel, V.

AU - Bakish, I.

AU - Kraus, T.

AU - Shubely, M.

AU - Ben-Ezra, Y.

AU - Shekel, E.

AU - Zach, S.

AU - Zadok, A.

AU - Sukenik, C. N.

N1 - Place of conference:Los Angeles, California United States

PY - 2012

Y1 - 2012

N2 - Procedures for wafer bonding between silicon and InP and between silicon and LiNbO3 at temperatures below 120 °C are reported. The bonding is based on the deposition of functionalized, organic self assembled monolayers.

AB - Procedures for wafer bonding between silicon and InP and between silicon and LiNbO3 at temperatures below 120 °C are reported. The bonding is based on the deposition of functionalized, organic self assembled monolayers.

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AN - SCOPUS:84893499466

SN - 9781557529381

T3 - Optics InfoBase Conference Papers

BT - Optical Fiber Communication Conference, OFC 2012

T2 - Optical Fiber Communication Conference, OFC 2012

Y2 - 4 March 2012 through 8 March 2012

ER -