Kinetics of phase formation during interdiffusion in the ternary system Ni-Cu-5 at.% Sn

L. N. Paritskaya; V. V. Bogdanov; M. V. Maslov; Yu S. Kaganovskii; W. Lojkowski; D. Kolesnikov

Kinetics of phase formation during interdiffusion in the ternary system Ni-Cu-5 at.% Sn

L. N. Paritskaya
, V. V. Bogdanov
, M. V. Maslov
, Yu S. Kaganovskii
, W. Lojkowski
, D. Kolesnikov

Department of Physics - at Bar-Ilan University

V. N. Karazin Kharkiv National University
Polish Academy of Sciences

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

Evolution of concentration profiles during interdiffusion in three-layer samples Cu(5 at.% Sn)-Ni(5 at.% Sn)-Cu(5 at.% Sn) with inert markers has been studied by the methods of optical microscopy and SEM with X-ray microprobe analysis. 'Up-hill' diffusion of Sn and formation of two-phase zones with periodically changing precipitates of (NiCu)₃Sn and metastable solution have been found. Interrelation between Kirkendall and Frenkel effects and 'up-hill' Sn diffusion has been discussed.

Original language	English
Pages (from-to)	107-112
Number of pages	6
Journal	Metallofizika i Noveishie Tekhnologii
Volume	21
Issue number	2
State	Published - 1999

Keywords

'Up-hill' diffusion
Directed vacancy flux
Interdiffusion
Two-phase zone formation

Cite this

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title = "Kinetics of phase formation during interdiffusion in the ternary system Ni-Cu-5 at.\% Sn",

abstract = "Evolution of concentration profiles during interdiffusion in three-layer samples Cu(5 at.\% Sn)-Ni(5 at.\% Sn)-Cu(5 at.\% Sn) with inert markers has been studied by the methods of optical microscopy and SEM with X-ray microprobe analysis. 'Up-hill' diffusion of Sn and formation of two-phase zones with periodically changing precipitates of (NiCu)3Sn and metastable solution have been found. Interrelation between Kirkendall and Frenkel effects and 'up-hill' Sn diffusion has been discussed.",

keywords = "'Up-hill' diffusion, Directed vacancy flux, Interdiffusion, Two-phase zone formation",

author = "Paritskaya, \{L. N.\} and Bogdanov, \{V. V.\} and Maslov, \{M. V.\} and Kaganovskii, \{Yu S.\} and W. Lojkowski and D. Kolesnikov",

year = "1999",

language = "אנגלית",

volume = "21",

pages = "107--112",

journal = "Metallofizika i Noveishie Tekhnologii",

issn = "1024-1809",

publisher = "G.V. Kurdyumov Institute for Metal Physics of N.A.S. of Ukraine",

number = "2",

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TY - JOUR

T1 - Kinetics of phase formation during interdiffusion in the ternary system Ni-Cu-5 at.% Sn

AU - Paritskaya, L. N.

AU - Bogdanov, V. V.

AU - Maslov, M. V.

AU - Kaganovskii, Yu S.

AU - Lojkowski, W.

AU - Kolesnikov, D.

PY - 1999

Y1 - 1999

N2 - Evolution of concentration profiles during interdiffusion in three-layer samples Cu(5 at.% Sn)-Ni(5 at.% Sn)-Cu(5 at.% Sn) with inert markers has been studied by the methods of optical microscopy and SEM with X-ray microprobe analysis. 'Up-hill' diffusion of Sn and formation of two-phase zones with periodically changing precipitates of (NiCu)3Sn and metastable solution have been found. Interrelation between Kirkendall and Frenkel effects and 'up-hill' Sn diffusion has been discussed.

AB - Evolution of concentration profiles during interdiffusion in three-layer samples Cu(5 at.% Sn)-Ni(5 at.% Sn)-Cu(5 at.% Sn) with inert markers has been studied by the methods of optical microscopy and SEM with X-ray microprobe analysis. 'Up-hill' diffusion of Sn and formation of two-phase zones with periodically changing precipitates of (NiCu)3Sn and metastable solution have been found. Interrelation between Kirkendall and Frenkel effects and 'up-hill' Sn diffusion has been discussed.

KW - 'Up-hill' diffusion

KW - Directed vacancy flux

KW - Interdiffusion

KW - Two-phase zone formation

UR - https://www.scopus.com/pages/publications/0344493366

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AN - SCOPUS:0344493366

SN - 1024-1809

VL - 21

SP - 107

EP - 112

JO - Metallofizika i Noveishie Tekhnologii

JF - Metallofizika i Noveishie Tekhnologii

IS - 2

ER -

Kinetics of phase formation during interdiffusion in the ternary system Ni-Cu-5 at.% Sn

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Keywords

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