Kinetics of phase formation during interdiffusion in the ternary system Ni-Cu-5 at.% Sn

L. N. Paritskaya, V. V. Bogdanov, M. V. Maslov, Yu S. Kaganovskii, W. Lojkowski, D. Kolesnikov

Research output: Contribution to journalArticlepeer-review

Abstract

The evolution of concentration profiles during interdiffusion in three-layer samples Cu(5 at.% Sn)-Ni(5 at.% Sn)-Cu(5 at.% Sn) with inert markers has been studied by the methods of optical microscopy and SEM with X-ray microprobe analysis. 'Up-hill' diffusion of Sn and formation of two-phase zones with periodically changing precipitates of (NiCu)3Sn and a metastable solution have been found. Interrelation between the Kirkendall and Frenkel effects and 'up-hill' Sn diffusion has been discussed.

Original languageEnglish
Pages (from-to)381-390
Number of pages10
JournalMetal Physics and Advanced Technologies
Volume19
Issue number2
StatePublished - 2001
Externally publishedYes

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