Kinetics of intermetallic growth under high pressure

L. N. Paritskaya, V. V. Bogdanov, Yu S. Kaganovskii, W. Lojkowski, J. Jun, A. Presz

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Abstract

The kinetics of the γ-phases Cd21Ni5 and Cu5Zn8 growth during interdiffusion in two-layer Cd-Ni and Zn-Cu samples has been studied under hydrostatic argon pressure 0.05 - 0.9 GPa in the temperature range 200 - 280°C. Kinetics of the intermetallic growth occurs due to diffusion of fast components Cd and Zn through the growing phase layer, in diffusional-kinetic regime for Cd21Ni5 and diffusion regime for Cu5Zn8. Arrhenius equations for Cd diffusion in Cd21Ni5, Zn diffusion in Cu5Zn8, and chemical reaction at the Cd21Ni5-Ni interface have been obtained at 0.05 and 0.9 GPa. Diffusion activation volumes have been estimated as 0.9V0 and 0.6V0 for Cd and Zn respectively (V0 is the average volume per atom in the compounds), and the activation volume for reaction has been found to be 1.6V0. Diffusion mechanisms are discussed.

Original languageEnglish
Pages (from-to)1-11
Number of pages11
JournalDefect and Diffusion Forum
Volume175-176
StatePublished - 1999

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