Improved algorithm for automated alignment of wafers via optimized features location

We present a new fuzzy logic-based approach for automatic optimized features location. The technique is used for improved automatic alignment and classification of silicon wafers and chips that are used in the electronics industry. The proposed automatic image processing approach was realized and experimentally demonstrated in real industrial application with typical wafers. The automatic features location and grading supported the industrial requirements and could replace human expert-based inspection that currently is performed manually.