Hydrodynamics of a chemical-mechanical planarization process

In Sung Sohn; Brij Moudgil; Rajiv Singh; C. W. Park

doi:10.1557/proc-566-181

Hydrodynamics of a chemical-mechanical planarization process

In Sung Sohn, Brij Moudgil, Rajiv Singh, C. W. Park

University of Florida

Research output: Contribution to journal › Article › peer-review

6 Scopus citations

Abstract

The flow of a slurry in a CMP process has been investigated. This wafer-scale model provides the three dimensional flow field of the slurry, the spatial distribution of the local shear rate imposed on the wafer surface, and the streamline patterns which reflect the transport characteristics of the slurry.

Original language	English
Pages (from-to)	181-186
Number of pages	6
Journal	Materials Research Society Symposium - Proceedings
Volume	566
DOIs	https://doi.org/10.1557/proc-566-181
State	Published - 1999
Externally published	Yes

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abstract = "The flow of a slurry in a CMP process has been investigated. This wafer-scale model provides the three dimensional flow field of the slurry, the spatial distribution of the local shear rate imposed on the wafer surface, and the streamline patterns which reflect the transport characteristics of the slurry.",

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Hydrodynamics of a chemical-mechanical planarization process

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