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How pump-induced particles affect low-k CMP detectivity
F. C. Chang
, S. Tanawade
, Rajiv Singh
University of Florida
Research output
:
Contribution to specialist publication
›
Article
4
Scopus citations
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Keyphrases
Slurry
100%
Chemical Mechanical Planarization
100%
Defectivity
75%
Agglomeration
50%
Centrifugal Pump
50%
Positive Displacement Pump
50%
High Shear Flow
50%
Particle Distribution
25%
Water Surface
25%
Shear Flow
25%
Shear Stress
25%
Defect Density
25%
Chemical Nature
25%
Magnetic Levitation
25%
Particle Agglomeration
25%
Engineering
Defectivity
100%
Chemical Mechanical Polishing
100%
Shear Flow
100%
Centrifugal Pump
66%
Positive Displacement Pumps
66%
Defect Density
33%
Surface Water
33%
Material Science
Chemical Mechanical Planarization
100%
Shear Flow
100%
Defect Density
33%
Particle Agglomeration
33%