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GaAs high temperature optical constants and application to optical monitoring within the MOVPE environment

  • D. A. Allwood
  • , P. C. Klipstein
  • , N. J. Mason
  • , R. J. Nicholas
  • , P. J. Walker
  • University of Oxford

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

The real and imaginary components of the GaAs refractive index at temperatures between 20-700 °C have been obtained. Measurements were made by comparing the variable angle reflectivity of p-polarized and s-polarized 633 nm wavelength light from a deoxidized GaAs surface. By using these temperature-dependent optical constants for GaAs, modeling has allowed the behavior of surface photoabsorption (SPA) signals with temperature and oxide layers present to be predicted for different angles of incidence. The experimentally observed SPA signals during deoxidization of GaAs show strong qualitative agreement with these calculations at each of the angles of incidence considered. The measurement of data and application to modeling provides a platform for the measurement of temperature-dependent optical data for other III-V materials and for the investigation of deoxidation mechanisms.

Original languageEnglish
Pages (from-to)99-105
Number of pages7
JournalJournal of Electronic Materials
Volume29
Issue number1
DOIs
StatePublished - Jan 2000
Externally publishedYes

Bibliographical note

Funding Information:
The authors would like to thank Wafer Technology Ltd. (Milton Keynes, U.K.) both for financial support and provision of substrate materials. Furthermore, the Teaching Company Directorate (scheme number 2221) and EPSRC (grant GR/K76962) are thanked for financial support. The technical assistance of K.R. Belcher and S.J. Moulder is also gratefully acknowledged.

Funding

The authors would like to thank Wafer Technology Ltd. (Milton Keynes, U.K.) both for financial support and provision of substrate materials. Furthermore, the Teaching Company Directorate (scheme number 2221) and EPSRC (grant GR/K76962) are thanked for financial support. The technical assistance of K.R. Belcher and S.J. Moulder is also gratefully acknowledged.

FundersFunder number
Wafer Technology Ltd.2221
Engineering and Physical Sciences Research CouncilGR/K76962

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