TY - JOUR
T1 - Fabrication of delamination free, low stress diamond like carbon (dlc) films using pulsed laser deposition (PLD)
AU - Arjunan, Arul Chakkaravarthi
AU - Balasundaram, Kannan
AU - Kumar, Purushottam
AU - Lee, Jaeseok
AU - Yoon, Sang Hyun
AU - Kim, Sejin
AU - Gupta, Sushant
AU - Singh, Rajiv K.
PY - 2012
Y1 - 2012
N2 - Poor adhesion and delamination of diamond-like carbon(DLC) films due to high residual stresses has been a long standing challenge for thick (>1μ m) DLC films. In this study, delamination-free and low stress DLC films were deposited using multi-cycle pulsed laser deposition (MCPLD) from a graphite target. Residual stress values of a micron thick film prepared by MCPLD was 2 GPa, as compared to 9 GPa in films deposited by conventional or single cycle pulsed laser deposition (SCPLD). Adhesion failure was completely absent in the DLC films prepared by the MCPLD process owing to such low residual stress.
AB - Poor adhesion and delamination of diamond-like carbon(DLC) films due to high residual stresses has been a long standing challenge for thick (>1μ m) DLC films. In this study, delamination-free and low stress DLC films were deposited using multi-cycle pulsed laser deposition (MCPLD) from a graphite target. Residual stress values of a micron thick film prepared by MCPLD was 2 GPa, as compared to 9 GPa in films deposited by conventional or single cycle pulsed laser deposition (SCPLD). Adhesion failure was completely absent in the DLC films prepared by the MCPLD process owing to such low residual stress.
UR - https://www.scopus.com/pages/publications/82955223342
U2 - 10.1149/2.010201esl
DO - 10.1149/2.010201esl
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AN - SCOPUS:82955223342
SN - 1099-0062
VL - 15
SP - H17-H19
JO - Electrochemical and Solid-State Letters
JF - Electrochemical and Solid-State Letters
IS - 1
ER -