Fabrication of delamination free, low stress diamond like carbon (dlc) films using pulsed laser deposition (PLD)

Arul Chakkaravarthi Arjunan, Kannan Balasundaram, Purushottam Kumar, Jaeseok Lee, Sang Hyun Yoon, Sejin Kim, Sushant Gupta, Rajiv K. Singh

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

Poor adhesion and delamination of diamond-like carbon(DLC) films due to high residual stresses has been a long standing challenge for thick (>1μ m) DLC films. In this study, delamination-free and low stress DLC films were deposited using multi-cycle pulsed laser deposition (MCPLD) from a graphite target. Residual stress values of a micron thick film prepared by MCPLD was 2 GPa, as compared to 9 GPa in films deposited by conventional or single cycle pulsed laser deposition (SCPLD). Adhesion failure was completely absent in the DLC films prepared by the MCPLD process owing to such low residual stress.

Original languageEnglish
Pages (from-to)H17-H19
JournalElectrochemical and Solid-State Letters
Volume15
Issue number1
DOIs
StatePublished - 2012
Externally publishedYes

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