Enhancing EMI-Packaging to Protect Against Fault Injection and Side-Channel Attacks

Many countermeasures at many hierarchical levels have been developed over the years by researchers and companies in order to handle passive side-channel analysis and active fault-injection attacks. This paper focuses on shielding-based solutions to mitigate the leaking electromagnetic information that can be exploited by an SCA attacker, and in solutions aiming to prevent information extraction by FI attacks. A review of the main protection schemes utilizing shields in various physical layers is provided. Furthermore, a novel in-package countermeasure architecture is presented, relying on existing packaging-industry technologies, with security criteria consideration.