Abstract
Many countermeasures at many hierarchical levels have been developed over the years by researchers and companies in order to handle passive side-channel analysis and active fault-injection attacks. This paper focuses on shielding-based solutions to mitigate the leaking electromagnetic information that can be exploited by an SCA attacker, and in solutions aiming to prevent information extraction by FI attacks. A review of the main protection schemes utilizing shields in various physical layers is provided. Furthermore, a novel in-package countermeasure architecture is presented, relying on existing packaging-industry technologies, with security criteria consideration.
| Original language | English |
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| Title of host publication | 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9798350348187 |
| DOIs | |
| State | Published - 2024 |
| Event | 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024 - Tel Aviv, Israel Duration: 9 Jul 2024 → 11 Jul 2024 |
Publication series
| Name | 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024 |
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Conference
| Conference | 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024 |
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| Country/Territory | Israel |
| City | Tel Aviv |
| Period | 9/07/24 → 11/07/24 |
Bibliographical note
Publisher Copyright:© 2024 IEEE.
Keywords
- Design for Manufacturing (DFM)
- Electromagnetic Compatibility (EMC)
- Electromagnetic Interference (EMI)
- Fault Injection Attacks (FIA)
- Packaging
- Radio-Frequency Interference (RFI)
- Shielding
- Side-Channel Attacks (SCA)