Enhanced Tungsten Chemical Mechanical Polishing Using Stable Alumina Slurries

M. Bielmann; U. Mahajan; R. K. Singh; D. O. Shah; B. J. Palla

doi:10.1149/1.1390765

Enhanced Tungsten Chemical Mechanical Polishing Using Stable Alumina Slurries

M. Bielmann, U. Mahajan, R. K. Singh, D. O. Shah, B. J. Palla

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

Abstract

The chemical mechanical polishing of tungsten using stabilized alumina slurries has been investigated. To stabilize the alumina slurries in the presence of high concentration of an oxidizer [K₃Fe(CN)₆] at acidic pH, a combination of anionic (sodium dodecyl sulfate, SDS) and nonionic (polysorbate 80, Tween 80) surfactants were added. Static electrochemical measurements were carried out to compare the slurries with and without the surfactant. Chemical mechanical polishing experiments showed that the removal rate of tungsten decreases in the presence of a stable slurry. These experiments have also shown that the local roughness of the polished surface can be reduced significantly using a stable slurry. Finally, the adhesion of alumina particles on tungsten and silica surfaces has been reduced by more than an order of magnitude due to the presence of the surfactant.

Original language	English
Pages (from-to)	148-150
Number of pages	3
Journal	Electrochemical and Solid-State Letters
Volume	2
Issue number	3
DOIs	https://doi.org/10.1149/1.1390765
State	Published - Mar 1999
Externally published	Yes

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abstract = "The chemical mechanical polishing of tungsten using stabilized alumina slurries has been investigated. To stabilize the alumina slurries in the presence of high concentration of an oxidizer [K3Fe(CN)6] at acidic pH, a combination of anionic (sodium dodecyl sulfate, SDS) and nonionic (polysorbate 80, Tween 80) surfactants were added. Static electrochemical measurements were carried out to compare the slurries with and without the surfactant. Chemical mechanical polishing experiments showed that the removal rate of tungsten decreases in the presence of a stable slurry. These experiments have also shown that the local roughness of the polished surface can be reduced significantly using a stable slurry. Finally, the adhesion of alumina particles on tungsten and silica surfaces has been reduced by more than an order of magnitude due to the presence of the surfactant.",

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AU - Bielmann, M.

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AU - Palla, B. J.

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Enhanced Tungsten Chemical Mechanical Polishing Using Stable Alumina Slurries

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