Enhanced adhesion of diamond thin films on WC/Co substrates

Keyphrases

• Surface Roughness 100%
• Diamond Film 100%
• Diamond Thin Films 100%
• Enhanced Adhesion 100%
• WC-Co Substrate 100%
• Adhesion 50%
• Surface Modification 50%
• High Energy Density 50%
• Surface Structure 50%
• Pulse number 50%
• Surface Morphology 50%
• Chemical Vapor Deposition Processes 50%
• Microroughness 50%
• Tungsten Carbide 50%
• Carbide Layer 50%
• Incident Energy 50%
• Compositionally Graded 50%
• Etching Treatment 50%
• Graded Interface 50%
• Hot Filament Chemical Vapor Deposition (HFCVD) 50%
• Pulsed Laser Process 50%
• Laser Condition 50%
• Cobalt Binder 50%
• Carbide Tool Inserts 50%
• Laser Etching 50%
• Cemented Carbide Tool 50%

Material Science

• Diamond 100%
• Thin Films 100%
• Surface Roughness 100%
• Diamond Films 100%
• Energy Density 50%
• Tungsten 50%
• Carbide 50%
• Surface Morphology 50%
• Cobalt 50%
• Surface Structure 50%
• Vapor Phase Deposition 50%
• Cemented Carbide 50%
• Hot-Filament Chemical Vapor Deposition 50%
• Surface Treatment 50%

Engineering

• Diamond 100%
• Enhanced Adhesion 100%
• Thin Films 100%
• Binders 33%
• Pulsed Laser 33%
• Structure Surface 33%
• Incident Energy 33%
• Etching Treatment 33%
• Energy Density 33%
• Surface Morphology 33%
• Deposition Process 33%
• Chemical Vapor Deposition 33%
• Vapor Deposition 33%