Effect of silicon pre-nitridation on the formation of the interfacial layer during pulsed laser deposition of thin dielectric oxide films

Thin high-k dielectric Y ₂ O ₃ and ZrO ₂ films were grown directly on Si by the pulsed laser deposition (PLD) technique. The interfacial layer formed between the Si and the deposited oxide film was characterized. Since this layer has a detrimental effect on the MOS capacitance of the films, an attempt to modify its characteristics was performed through UV-assisted low-temperature nitridation of the surface to create a barrier layer that suppresses Si diffusion through the interface. It was confirmed by structural characterization that this surface pretreatment results in a thinner interfacial layer.