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Effect of particle size during tungsten chemical mechanical polishing
Marc Bielmann
, Uday Mahajan
, Rajiv K. Singh
University of Florida
Research output
:
Contribution to journal
›
Article
›
peer-review
6
Scopus citations
Overview
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Dive into the research topics of 'Effect of particle size during tungsten chemical mechanical polishing'. Together they form a unique fingerprint.
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Keyphrases
Particle Size
100%
Particle Size Effect
100%
Tungsten
100%
Alumina Nanoparticles
100%
Removal Rate
100%
Chemical Mechanical Polishing
100%
Particle Surface
66%
Contact Surface Area
66%
Polished Surface
66%
Tungsten Removal
66%
Silica
33%
Surface Roughness
33%
Reaction Rate
33%
Semiconductor Processing
33%
Solid Loading
33%
Tungsten Surface
33%
Polishing Rate
33%
Local Roughness
33%
Abrasive Particle Size
33%
Interconnect Materials
33%
Engineering
Size of Particle
100%
Chemical Mechanical Polishing
100%
Removal Rate
100%
Alumina Particle
100%
Contact Surface
66%
Interconnects
33%
Critical Role
33%
Abrasive Particle
33%
Material Science
Tungsten
100%
Chemical Mechanical Planarization
100%
Aluminum Oxide
60%
Polishing
40%
Silicon Dioxide
20%
Surface Roughness
20%