Effect of nano-size silica abrasives in chemical mechanical polishing of copper

Keyphrases

• Nanosize 100%
• Silica 100%
• Abrasive 100%
• Chemical Mechanical Polishing 100%
• Removal Mechanism 66%
• Removal Rate 66%
• Surface Layer 33%
• Oxide Formation 33%
• Complexing Agent 33%
• Surface Roughness 33%
• Etching Rate 33%
• Mechanical Stress 33%
• Low Stress 33%
• Oxidizer 33%
• Chemical Surface Modification 33%
• Modified Surface Layer 33%
• Low Hardness 33%
• Stress Polishing 33%
• Alumina Abrasive 33%
• Passivated 33%
• Surface Scratch 33%

Engineering

• Chemical Mechanical Polishing 100%
• Abrasive 100%
• Removal Rate 50%
• Surface Layer 50%
• Aluminum Oxide 25%
• Etch Rate 25%
• Defects 25%
• Modified Surface 25%
• Mechanical Stress 25%
• Complexing Agent 25%
• Oxidizer 25%

Material Science

• Silicon Dioxide 100%
• Chemical Mechanical Planarization 100%
• Aluminum Oxide 33%
• Mechanical Stress 33%
• Polishing 33%
• Surface Scratches 33%
• Oxide Compound 33%
• Surface Roughness 33%